Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

Alaric Yohei Kawai Pétillot; Shuichi Shoji; Hiroshi Kawarada; Jun Mizuno

doi:10.23919/ICEP58572.2023.10129767

Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

Alaric Yohei Kawai Pétillot, Shuichi Shoji, Hiroshi Kawarada, Jun Mizuno

智慧與永續製造學位學程

研究成果: Conference contribution

摘要

Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.

原文	English
主出版物標題	2023 International Conference on Electronics Packaging, ICEP 2023
發行者	Institute of Electrical and Electronics Engineers Inc.
頁面	31-32
頁數	2
ISBN（電子）	9784991191152
DOIs	https://doi.org/10.23919/ICEP58572.2023.10129767
出版狀態	Published - 2023
事件	22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan 持續時間: 2023 4月 19 → 2023 4月 22

出版系列

名字	2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference	22nd International Conference on Electronics Packaging, ICEP 2023
國家/地區	Japan
城市	Kumamoto
期間	23-04-19 → 23-04-22

All Science Journal Classification (ASJC) codes

電氣與電子工程
工業與製造工程
材料力學
安全、風險、可靠性和品質
電子、光磁材料

存取文件

10.23919/ICEP58572.2023.10129767

其它文件與鏈接

引用此

Pétillot, A. Y. K., Shoji, S., Kawarada, H., & Mizuno, J. (2023). Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. 於 2023 International Conference on Electronics Packaging, ICEP 2023 (頁 31-32). (2023 International Conference on Electronics Packaging, ICEP 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP58572.2023.10129767

Pétillot, Alaric Yohei Kawai ; Shoji, Shuichi ; Kawarada, Hiroshi 等. / Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. 頁 31-32 (2023 International Conference on Electronics Packaging, ICEP 2023).

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title = "Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer",

abstract = "Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.",

author = "P{\'e}tillot, {Alaric Yohei Kawai} and Shuichi Shoji and Hiroshi Kawarada and Jun Mizuno",

note = "Publisher Copyright: {\textcopyright} 2023 Japan Institute of Electronics Packaging.; 22nd International Conference on Electronics Packaging, ICEP 2023 ; Conference date: 19-04-2023 Through 22-04-2023",

year = "2023",

doi = "10.23919/ICEP58572.2023.10129767",

language = "English",

series = "2023 International Conference on Electronics Packaging, ICEP 2023",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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Pétillot, AYK, Shoji, S, Kawarada, H & Mizuno, J 2023, Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. 於 2023 International Conference on Electronics Packaging, ICEP 2023. 2023 International Conference on Electronics Packaging, ICEP 2023, Institute of Electrical and Electronics Engineers Inc., 頁 31-32, 22nd International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 23-04-19. https://doi.org/10.23919/ICEP58572.2023.10129767

Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. / Pétillot, Alaric Yohei Kawai; Shoji, Shuichi; Kawarada, Hiroshi 等.
2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 31-32 (2023 International Conference on Electronics Packaging, ICEP 2023).

研究成果: Conference contribution

TY - GEN

T1 - Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

AU - Pétillot, Alaric Yohei Kawai

AU - Shoji, Shuichi

AU - Kawarada, Hiroshi

AU - Mizuno, Jun

PY - 2023

Y1 - 2023

N2 - Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.

AB - Cu bonding with an addition of an interfacial layer has been gaining attention for providing low-temperature bonding solutions for direct Cu bonding in advanced packaging. In this paper, Cu surfaces with an Au passivation layer were exposed to various dry surface treatments and analyzed by XPS to understand the effects of carbon contaminants on bonding strength. We have shown that VUV N2 treated samples improved the bonding strength and yield significantly compared to the bare samples as various carboxyl and carbonyl groups were removed from the bonding interface.

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DO - 10.23919/ICEP58572.2023.10129767

M3 - Conference contribution

AN - SCOPUS:85161845757

T3 - 2023 International Conference on Electronics Packaging, ICEP 2023

SP - 31

EP - 32

BT - 2023 International Conference on Electronics Packaging, ICEP 2023

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 22nd International Conference on Electronics Packaging, ICEP 2023

Y2 - 19 April 2023 through 22 April 2023

ER -

Pétillot AYK, Shoji S, Kawarada H, Mizuno J. Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer. 於 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 31-32. (2023 International Conference on Electronics Packaging, ICEP 2023). doi: 10.23919/ICEP58572.2023.10129767

Effects of Surface Contaminants on Bonding Strength for Direct Cu-Cu Bonding with Passivation Layer

摘要

出版系列

Conference

All Science Journal Classification (ASJC) codes

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其它文件與鏈接

指紋

引用此