Effects of thermal storage and Cu addition on adhesive strength and microstructure of Sn-3.0 mass% Ag-1.5 mass% Sb-xCu solder joints

Hwa-Teng Lee, Wen Yeong Huang

研究成果: Article

1 引文 (Scopus)

摘要

This paper examines the effects of the thermal storage time and Cu addition on the adhesive strength and microstructure of lead-free Sn-3.0 mass% Ag-1.5 mass% Sb-xCu solder joints. The experimental results show that the adhesive strength of the as-soldered specimens increases with increasing Cu addition and increasing strain rate. Meanwhile, for the aged specimens, the adhesive strength increases with increasing strain rate, but decreases with increasing storage time or with increasing Cu addition beyond 1.0mass%. The microstructures and fracture morphologies of the solder specimens are analyzed by optical microscopy (OM) and scanning electron microscopy (SEM). The observations reveal that the Cu6Sn5 and Ag3Sn particles within the solder microstructure coarsen following high temperature storage and thus reduce the adhesive strength of the solder. Finally, it is found that the prolonged aged specimens with a Cu addition of 0.5 mass% or 1.0 mass% fracture in a combined brittle and ductile failure mode, while those with a Cu addition of 1.5 mass% fail as a result of cleavage after following 200 hours of thermal storage and a strain rate of over 1 s-1, but otherwise these fracture in a combined brittle and ductile failure mode.

原文English
頁(從 - 到)899-908
頁數10
期刊Materials Transactions
50
發行號4
DOIs
出版狀態Published - 2009 四月 1

指紋

solders
Soldering alloys
adhesives
Adhesives
Strain rate
microstructure
Microstructure
strain rate
Failure modes
failure modes
Optical microscopy
Lead
cleavage
Scanning
Scanning electron microscopy
Hot Temperature
microscopy
scanning electron microscopy
Temperature

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

引用此文

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abstract = "This paper examines the effects of the thermal storage time and Cu addition on the adhesive strength and microstructure of lead-free Sn-3.0 mass{\%} Ag-1.5 mass{\%} Sb-xCu solder joints. The experimental results show that the adhesive strength of the as-soldered specimens increases with increasing Cu addition and increasing strain rate. Meanwhile, for the aged specimens, the adhesive strength increases with increasing strain rate, but decreases with increasing storage time or with increasing Cu addition beyond 1.0mass{\%}. The microstructures and fracture morphologies of the solder specimens are analyzed by optical microscopy (OM) and scanning electron microscopy (SEM). The observations reveal that the Cu6Sn5 and Ag3Sn particles within the solder microstructure coarsen following high temperature storage and thus reduce the adhesive strength of the solder. Finally, it is found that the prolonged aged specimens with a Cu addition of 0.5 mass{\%} or 1.0 mass{\%} fracture in a combined brittle and ductile failure mode, while those with a Cu addition of 1.5 mass{\%} fail as a result of cleavage after following 200 hours of thermal storage and a strain rate of over 1 s-1, but otherwise these fracture in a combined brittle and ductile failure mode.",
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