Effects of wafer carrier design on contact stress uniformity in CMP

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Here we use 2-D models of fluid film lubrication and contact mechanics to calculate the contact stress and fluid (i.e., slurry) pressure distributions on the wafer-pad interface in CMP. In particular, the effective rigidity of the wafer (determined by the wafer carrier structure), the retaining ring width and its back pressure are taken to be the design parameters. The purpose is to study the synergetic effects of such parameters on the contact stress non-uniformity (NU), which directly affects the spatial non-uniformity of the material removal rate on the wafer surface. Our numerical results indicate that, for a given wafer rigidity, one may choose a particular combination of the retaining ring parameters to minimize NU. Also, the corresponding minimum NU decreases with the effective wafer rigidity, suggesting that it is beneficial to use a soft (e.g., floating-type) wafer carrier. Moreover, for a soft wafer carrier, the presence of the retaining ring also reduces NU to some extent, but the use of a multi-zone wafer-back pressure profile would be more effective in this regard

原文English
主出版物標題Advances in Abrasive Technology XIII
頁面305-310
頁數6
DOIs
出版狀態Published - 2010
事件13th International Symposium on Advances in Abrasive Technology, ISAAT2010 - Taipei, Taiwan
持續時間: 2010 九月 192010 九月 22

出版系列

名字Advanced Materials Research
126-128
ISSN(列印)1022-6680

Other

Other13th International Symposium on Advances in Abrasive Technology, ISAAT2010
國家Taiwan
城市Taipei
期間10-09-1910-09-22

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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