TY - JOUR
T1 - Electric contact resistance for monitoring nanoindentation-induced delamination
AU - Nguyen, Huu Hung
AU - Wei, Pal Jen
AU - Lin, Jen Fin
PY - 2011/3
Y1 - 2011/3
N2 - This study applied an in situ electric contact resistance technique to monitor delamination induced by indentation loads. A suddenly increasing indentation depth, together with a simultaneous drop in monitoring contact current, suggests that delamination occurred. During unloading processes, the rapid decrease in both contact depth and current imply that the delaminated film was suspended as long as the indentation load became sufficiently small. When delamination occurred during oscillating processes, the contact current was found to drop from an initial value to a steady value, which is related to a loss of interfacial contact.
AB - This study applied an in situ electric contact resistance technique to monitor delamination induced by indentation loads. A suddenly increasing indentation depth, together with a simultaneous drop in monitoring contact current, suggests that delamination occurred. During unloading processes, the rapid decrease in both contact depth and current imply that the delaminated film was suspended as long as the indentation load became sufficiently small. When delamination occurred during oscillating processes, the contact current was found to drop from an initial value to a steady value, which is related to a loss of interfacial contact.
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U2 - 10.1088/2043-6262/2/1/015007
DO - 10.1088/2043-6262/2/1/015007
M3 - Article
AN - SCOPUS:84867329896
SN - 2043-6262
VL - 2
JO - Advances in Natural Sciences: Nanoscience and Nanotechnology
JF - Advances in Natural Sciences: Nanoscience and Nanotechnology
IS - 1
M1 - 015007
ER -