Electric contact resistance for monitoring nanoindentation-induced delamination

Huu Hung Nguyen, Pal Jen Wei, Jen Fin Lin

研究成果: Article同行評審

13 引文 斯高帕斯(Scopus)

摘要

This study applied an in situ electric contact resistance technique to monitor delamination induced by indentation loads. A suddenly increasing indentation depth, together with a simultaneous drop in monitoring contact current, suggests that delamination occurred. During unloading processes, the rapid decrease in both contact depth and current imply that the delaminated film was suspended as long as the indentation load became sufficiently small. When delamination occurred during oscillating processes, the contact current was found to drop from an initial value to a steady value, which is related to a loss of interfacial contact.

原文English
文章編號015007
期刊Advances in Natural Sciences: Nanoscience and Nanotechnology
2
發行號1
DOIs
出版狀態Published - 2011 3月

All Science Journal Classification (ASJC) codes

  • 一般材料科學
  • 工業與製造工程
  • 電氣與電子工程

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