Electric current-induced plastic deformation: An in situ experimental study

研究成果: Conference contribution

摘要

Recent study has shown that electron flow would induce a non-uniform lattice strain along the strip and the electric current stress-induced deformation is suggested to have the same context with the conventional solid mechanics' theory. The electromigration (EM) effect is thus suggested to be a local stress relaxation at the condition beyond the critical point. In this study, in situ current stressing experiment with synchrotron radiation-based XRD and in situ SEM equipped with EBSD system were employed to investigate the electric current-induced plastic deformation. The results revealed that at a relatively higher level of current density and the corresponding lattice strain, twinning accompanied with the voids/hillocks formation would be found. When slightly decreasing the current density, no twinning but only voids/hillocks formation could be found. The authors hope this study will advance the knowledge of electric current-induced plastic deformation and provide a further guideline for EM-resistant materials.

原文English
主出版物標題2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
發行者Institute of Electrical and Electronics Engineers Inc.
頁面197-198
頁數2
ISBN(電子)9784990218850
DOIs
出版狀態Published - 2018 6月 6
事件2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 - Kuwana, Mie, Japan
持續時間: 2018 4月 172018 4月 21

出版系列

名字2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018

Other

Other2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
國家/地區Japan
城市Kuwana, Mie
期間18-04-1718-04-21

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 電子、光磁材料
  • 聚合物和塑料

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