Electrical tensile test

Hao Wen Hsueh, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen

研究成果: Conference contribution

摘要

It is a tendency toward reducing diameter of bonding wires that could increase the counts of joints and reduced the volume. In the meantime, it would increases thermal stress and electrical current density. For this reason, a simple reliability analysis which included tension and electrical current was developed. Electrical tensile test is a robust and efficient scheme for dynamic reliability analysis. Compared to other reliability test, electrical tensile test could estimate tension and current density by one test. When electrical current, joule heat and tensile stress were applied simultaneously on a metal wire, the electrical tensile test was not to be compared to traditional tensile test. Both of tensile strength and elongation were decreased, few local grain growth and tensile-embrittlement was observed. In addition, the strength of wires was dropped 50% by higher electrical current density pass through that will reduce the reliability of the wire. Therefore, electrical tensile test is an efficiency dynamic reliability analysis method to avoid fracture happened.

原文English
主出版物標題20th European Microelectronics and Packaging Conference and Exhibition
主出版物子標題Enabling Technologies for a Better Life and Future, EMPC 2015
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9780956808622
出版狀態Published - 2016 一月 25
事件20th European Microelectronics and Packaging Conference and Exhibition, EMPC 2015 - Friedrichshafen, Germany
持續時間: 2015 九月 142015 九月 16

出版系列

名字20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015

Other

Other20th European Microelectronics and Packaging Conference and Exhibition, EMPC 2015
國家Germany
城市Friedrichshafen
期間15-09-1415-09-16

    指紋

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

引用此

Hsueh, H. W., Hung, F. Y., Lui, T. S., & Chen, L. H. (2016). Electrical tensile test. 於 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015 [7390694] (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015). Institute of Electrical and Electronics Engineers Inc..