摘要
This study investigated the electro-dissolution, supersaturation and recrystallization of the second phase Bi in the Sn5Bi solder under 4.0×103-6.0×103 A/cm2 current stressing at 25 °C. The ex-situ XRD analysis of the current stressed specimen, after being quenched with liquid nitrogen, reveals a reduction of the Bi orientation peaks. The SEM investigation shows the dissolution and supersaturation of the Bi phase during current stressing. The in-situ SEM investigation reveals that recrystallization of the Bi phase occurred in the unquenched specimen when the current stopped. The kinetics of the electro-dissolution were analyzed, and the results showed that the maximum dissolution rate occurred during the progress of current stressing.
原文 | English |
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頁(從 - 到) | 309-313 |
頁數 | 5 |
期刊 | Materials Letters |
卷 | 160 |
DOIs | |
出版狀態 | Published - 2015 12月 1 |
All Science Journal Classification (ASJC) codes
- 一般材料科學
- 凝聚態物理學
- 材料力學
- 機械工業