Electro-dissolution of the Bi second phase in Sn5Bi solder alloy

Tsung Chieh Chiu, Ying Ta Chiu, Kwang Lung Lin

研究成果: Article同行評審

8 引文 斯高帕斯(Scopus)

摘要

This study investigated the electro-dissolution, supersaturation and recrystallization of the second phase Bi in the Sn5Bi solder under 4.0×103-6.0×103 A/cm2 current stressing at 25 °C. The ex-situ XRD analysis of the current stressed specimen, after being quenched with liquid nitrogen, reveals a reduction of the Bi orientation peaks. The SEM investigation shows the dissolution and supersaturation of the Bi phase during current stressing. The in-situ SEM investigation reveals that recrystallization of the Bi phase occurred in the unquenched specimen when the current stopped. The kinetics of the electro-dissolution were analyzed, and the results showed that the maximum dissolution rate occurred during the progress of current stressing.

原文English
頁(從 - 到)309-313
頁數5
期刊Materials Letters
160
DOIs
出版狀態Published - 2015 十二月 1

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

指紋

深入研究「Electro-dissolution of the Bi second phase in Sn5Bi solder alloy」主題。共同形成了獨特的指紋。

引用此