Electrochemical behavior of aluminum during chemical mechanical polishing in phosphoric acid base slurry

Hong Shi Kuo, Wen Ta Tsai

研究成果: Article同行評審

39 引文 斯高帕斯(Scopus)

摘要

The electrochemical behavior of aluminum in chemical mechanical polishing (CMP) slurry was investigated using potentiodynamic polarization measurement and electrochemical imbalance spectroscopy. The slurry used was mainly composed of phosphoric acid, citric acid, and 50 nm Al2O3 particles. The effects of slurry flow and contact pressure on the electrochemical behavior of Al were explored. The roles of chemical and mechanical interaction on the removal rate of Al during CMP were also attempted. The results showed that the corrosion potential decreased with increasing contact pressure and platen rotating speed. The dissolution rate, which was in reversing proportion to the polarization resistance, also decreased with increasing the contact pressure and platen rotating speed. The repeated passivation, film breakdown due to mechanical abrasion, and metal dissolution steps took place during the simulating CMP process. The passive film formed in the testing slurry consisted of Al2O3, Al(OH)3, and AlPO4.

原文English
頁(從 - 到)149-154
頁數6
期刊Journal of the Electrochemical Society
147
發行號1
DOIs
出版狀態Published - 2000 一月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 可再生能源、永續發展與環境
  • 表面、塗料和薄膜
  • 電化學
  • 材料化學

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