Electrochemical properties of joints formed between Sn-9Zn-1.5Ag-1Bi alloys and Cu substrates in a 3.5 wt.% NaCl solution

Chih Yao Liu, Ying Ru Chen, Wang Long Li, Min Hsiung Hon, Moo Chin Wang

研究成果: Article同行評審

10 引文 斯高帕斯(Scopus)

摘要

The electrochemical properties of the joints formed between Sn-9Zn-1.5Ag-1Bi alloys and Cu substrates in a 3.5 wt.% NaCl solution have been investigated by potentiodynamic polarization, X-ray diffraction, and scanning electron microscopy. For the Sn-9Zn-1.5Ag-1Bi/Cu joints in a 3.5 wt.% NaCl solution, corrosion current (I corr), corrosion potential (E corr) and corrosion resistance (R p) are 2.46 × 10 -6 A/cm 2, -1.18 V, and 7.54 × 10 3Ωcm 2, respectively. Cu 6Sn 5, Cu 5Zn 8, and Ag 3Sn are formed at the interface between the Sn-9Zn-1.5Ag-xBi solder alloy and Cu substrate. The corrosion products of ZnCl 2, SnCl 2 and ZnO are formed at the Sn-9Zn-1.5Ag-xBi/Cu joints after polarization in a 3.5 wt.% NaCl solution. Pits are also formed on the surface of the solder alloys.

原文English
頁(從 - 到)1531-1535
頁數5
期刊Journal of Electronic Materials
36
發行號11
DOIs
出版狀態Published - 2007 十一月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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