Electrodeposited CuSCN metal-semiconductor-metal high performance deep-ultraviolet photodetector

  • Hsueh Pin Lin
  • , Xuan Jun Lin
  • , Dung Ching Perng

研究成果: Article同行評審

19 引文 斯高帕斯(Scopus)

摘要

This study reports a low-cost electrodeposited copper(I) thiocyanate (CuSCN) film as a wide band-gap absorber layer for deep-ultraviolet (DUV) photodetector (PD) applications. Electrodeposited CuSCN films deposited with electrolyte concentrations of 24 mM and 33 mM were evaluated as the absorber layers for planar metal-semiconductor-metal PDs. The best photo-responsivity of the CuSCN PD was found to be as high as 70.3 A/W at a -1 V bias under DUV illumination at 300 nm, which corresponded to an external quantum efficiency of 3.1 × 104%. Furthermore, the DUV-to-visible rejection ratio (R300 nm/R400 nm) of ∼103 was realized. This study demonstrated that the CuSCN film has great potential for low-cost DUV PD applications.

原文English
文章編號021107
期刊Applied Physics Letters
112
發行號2
DOIs
出版狀態Published - 2018 1月 8

All Science Journal Classification (ASJC) codes

  • 物理與天文學(雜項)

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