Flip chip solder bumps have been electrodeposited from fluoroborate and sulfonate baths to compare the performance of these two baths with respect to growth behavior, composition and bump height of the eutectic solder bumps on a 4-in. silicon wafer. In general, the fluoroborate bath gives rise to a slower deposition rate than the sulfonate bath, while a slightly better bump uniformity is achieved. The solder bumps exhibit a smooth surface appearance when electrodeposited from a sulfonate bath.
|專業出版物||Plating and Surface Finishing|
|出版狀態||Published - 2000 三月 1|
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