Electrodeposition Behaviors of Solder Bumps from Fluoroborate & Sulfonate Baths

Kwang Lung Lin, Kun Tzu Hsu

研究成果: Article

4 引文 斯高帕斯(Scopus)

摘要

Flip chip solder bumps have been electrodeposited from fluoroborate and sulfonate baths to compare the performance of these two baths with respect to growth behavior, composition and bump height of the eutectic solder bumps on a 4-in. silicon wafer. In general, the fluoroborate bath gives rise to a slower deposition rate than the sulfonate bath, while a slightly better bump uniformity is achieved. The solder bumps exhibit a smooth surface appearance when electrodeposited from a sulfonate bath.

原文English
頁面86-89
頁數4
87
3
專業出版物Plating and Surface Finishing
出版狀態Published - 2000 三月 1

All Science Journal Classification (ASJC) codes

  • 表面和介面
  • 表面、塗料和薄膜
  • 材料化學

指紋

深入研究「Electrodeposition Behaviors of Solder Bumps from Fluoroborate & Sulfonate Baths」主題。共同形成了獨特的指紋。

引用此