Electrodeposition of Cu-Zn alloy from a Lewis acidic ZnCl 2-EMIC molten salt

Po Yu Chen, Mei Chen Lin, I. Wen Sun

研究成果: Article同行評審

67 引文 斯高帕斯(Scopus)

摘要

The electrodeposition of copper and copper-zinc alloys was investigated on tungsten and nickel electrodes in a Lewis acidic 50.0-50.0 mol % zinc chloride-1-ethyl-3-methylimidazolium chloride molten salt containing copper(I). The composition of the electrodeposited Cu-Zn alloys can be varied by deposition potential, temperature, and Cu(I) concentration of the plating bath. Analysis of the chronoamperometric transient behavior during electrodeposition suggests that pure copper electrodeposition proceeds via three-dimensional instantaneous nucleation with diffusion-controlled growth. However, as the deposition potential crosses from Cu metal into the alloy-forming range, the nucleation process changes to three-dimensional progressive nucleation with diffusion-controlled growth. Analysis of the X-ray diffraction patterns indicates that the electrodeposited Cu-Zn alloys exhibit α and β phases. The surface morphologies and the compositions of the electrodeposited Cu-Zn alloys were studied with scanning electron microscopy (SEM) and energy-dispersive spectroscopy (EDS).

原文English
頁(從 - 到)3350-3355
頁數6
期刊Journal of the Electrochemical Society
147
發行號9
DOIs
出版狀態Published - 2000 九月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 可再生能源、永續發展與環境
  • 表面、塗料和薄膜
  • 電化學
  • 材料化學

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