Electrodeposition of eutectic Sn-Zn alloy by pulse plating

Kwang Lung Lin, Li Min Sun

研究成果: Article同行評審

13 引文 斯高帕斯(Scopus)

摘要

A uniform deposition of a Sn-Zn alloy deposit was achieved by pulse plating. Apparently, the relative composition of Sn and Zn in the deposit was affected by the bath compositions and pulse condition. A pulse-plating condition of 99.9 ms on-time and 1.0 ms off-time gave rise to a eutectic Sn-Zn deposit, with a eutectic temperature of 198.8 °C (as analyzed by differential scanning calorimetry) and a uniform composition distribution across the deposit. A mechanism for explaining the pulse-deposition behavior of the Sn-Zn eutectic deposit was proposed. A longer off-time period, 99.9 ms versus 0.1 ms, resulted in a nodular, yet thinner deposit.

原文English
頁(從 - 到)2203-2207
頁數5
期刊Journal of Materials Research
18
發行號9
DOIs
出版狀態Published - 2003 九月

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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