Electroelastic fields and effective moduli of a medium containing cavities or rigid inclusions of arbitrary shape under anti-plane mechanical and in-plane electric fields

T. Chen, S. C. Chiang

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10 引文 斯高帕斯(Scopus)

摘要

We examine the two-dimensional problem of an infinite piezoelectric medium containing a solitary cavity or rigid inclusion of arbitrary shape, subjected to a coupled anti-plane mechanical and in-plane electric load at the remote boundary of the matrix. Conformal mapping techniques are employed to analyze the boundary value problems. Specific results are given for elliptical, polygonal and star-shape inclusions. Local fields of this type are used to estimate the overall moduli of a medium containing voids or rigid inclusions. This is accomplished with the help of an extension of Eshelby's formula which evaluates the total electric enthalpy by a particular line integral. Explicit estimates of the effective moduli are derived for dilute as well as for moderate area fractions of inclusions. The formulae depend solely on the cross area of the inclusion, area fraction and one particular coefficient of the mapping function. In addition, the stress and electric displacement singularities around the sharp corners of the inclusion are examined. The existence of uniform fields inside the inclusion is also envisaged. The present results, with appropriate modifications, apply equally well to those of thermoelectric and magnetoelectric effects.

原文English
頁(從 - 到)79-96
頁數18
期刊Acta Mechanica
121
DOIs
出版狀態Published - 1997 一月 1

All Science Journal Classification (ASJC) codes

  • 計算力學
  • 機械工業

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