Electromechanical coupling characteristics of MEMS micro cantilevers with applications

Kuang Shun Ou, Kuo Shen Chen

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

In this work, the electromechanical coupling behavior such as pull-in characteristics and dynamic responses of MEMS cantilevers has been investigated. In particular, this work addressed the three interrelated issues: first, The speedenergy-impact relationship of generalized electrostatic actuated MEMS by constructing a SIMULINK model, second, the pull-in voltage of micro cantilevers with the existence of both stress gradients and fringing effects was found, and finally, the development of command shaping approach for reducing the vibration or impact minimization of electrostatic actuation for enhancing the device longevity while maintaining the device performance. Throughout these three inter-related problems, it is possible to develop integrated dynamics for future applications whatever in performance enhancement or in improving the structural reliability of electrostatic actuated MEMS devices.

原文English
主出版物標題Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015
編輯Gerold Schropfer, Francis Pressecq, Marta Rencz, Peter Schneider, Yoshio Mita, Benoit Charlot, Pascal Nouet
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781479986255
DOIs
出版狀態Published - 2015 七月 16
事件17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015 - Montpellier, France
持續時間: 2015 四月 272015 四月 30

出版系列

名字Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015

Other

Other17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015
國家France
城市Montpellier
期間15-04-2715-04-30

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Electrical and Electronic Engineering

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    Ou, K. S., & Chen, K. S. (2015). Electromechanical coupling characteristics of MEMS micro cantilevers with applications. 於 G. Schropfer, F. Pressecq, M. Rencz, P. Schneider, Y. Mita, B. Charlot, & P. Nouet (編輯), Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015 [7161008] (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2015.7161008