Electromigration reliability of different metallization systems and structures under bidirectional current stress is studied in a wide frequency range (from mHz to 200 MHz). The experimental results show that at very low frequencies, the damage healing factor and lifetime under AC stress increases with increasing frequency. At high frequencies, the pure AC lifetime was found to be determined by the thermal migration instead of electromigration. All the observations are in agreement with an average current model indicating that while AC current contributes to self-heating, only the average (DC) current contributes to electromigration in all practical cases for interconnects and vias. The conclusion applies to all materials and geometries tested.
|頁（從 - 到）||180-187|
|期刊||Annual Proceedings - Reliability Physics (Symposium)|
|出版狀態||Published - 1996 一月 1|
|事件||Proceedings of the 1996 34th Annual IEEE International Reliability Physics - Dallas, TX, USA|
持續時間: 1996 四月 30 → 1996 五月 2
All Science Journal Classification (ASJC) codes