Electromigration design rules for bidirectional current

Jiang Tao, Jone F. Chen, Nathan W. Cheung, Chenming Hu

研究成果: Conference article同行評審

13 引文 斯高帕斯(Scopus)

摘要

Electromigration reliability of different metallization systems and structures under bidirectional current stress is studied in a wide frequency range (from mHz to 200 MHz). The experimental results show that at very low frequencies, the damage healing factor and lifetime under AC stress increases with increasing frequency. At high frequencies, the pure AC lifetime was found to be determined by the thermal migration instead of electromigration. All the observations are in agreement with an average current model indicating that while AC current contributes to self-heating, only the average (DC) current contributes to electromigration in all practical cases for interconnects and vias. The conclusion applies to all materials and geometries tested.

原文English
頁(從 - 到)180-187
頁數8
期刊Annual Proceedings - Reliability Physics (Symposium)
出版狀態Published - 1996 一月 1
事件Proceedings of the 1996 34th Annual IEEE International Reliability Physics - Dallas, TX, USA
持續時間: 1996 四月 301996 五月 2

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 安全、風險、可靠性和品質

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