Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging

Chien Lung Liang, Yung Sheng Lin, Chin Li Kao, David Tarng, Shan Bo Wang, Yun Ching Hung, Kwang Lung Lin

研究成果: Conference contribution

5 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Chemical Compounds