Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints

W. J. Deng, Kwang-Lung Lin, Y. T. Chiu, Y. S. Lai

研究成果: Conference contribution

7 引文 (Scopus)

摘要

The electromigration-induced accelerate consumption of Cu pad in flip chip Sn2.6Ag solder joint was studied. The under bump metallization on the chip side was 0.5 μm Ti/0.1 μm Cu/2.0 μm Ni, and on the substrate side was 20 μm thick Cu pad. The current stressing was conducted at a current density of 1.0×104 A/cm2. The uneven consumption morphology of Cu pad formed after reflow results in local current crowding at the cathodic pad side. The merge of the small concavities gives rise to the large cavities and wavelike morphology of Cu pad. The effect of current crowding at the wave tip caused rapid consumption of Cu pad. The entire 20 μm Cu pad was consumed at the current crowding area after current stressing of 478 h at 1.0×10 4 A/cm2. A mechanism was proposed for the accelerate consumption of Cu pad due to current stressing.

原文English
主出版物標題2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
頁面114-117
頁數4
DOIs
出版狀態Published - 2011 七月 21
事件2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
持續時間: 2011 五月 312011 六月 3

出版系列

名字Proceedings - Electronic Components and Technology Conference
ISSN(列印)0569-5503

Other

Other2011 61st Electronic Components and Technology Conference, ECTC 2011
國家United States
城市Lake Buena Vista, FL
期間11-05-3111-06-03

指紋

Electromigration
Soldering alloys
Metallizing
Current density
Substrates

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

引用此文

Deng, W. J., Lin, K-L., Chiu, Y. T., & Lai, Y. S. (2011). Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints. 於 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011 (頁 114-117). [5898500] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2011.5898500
Deng, W. J. ; Lin, Kwang-Lung ; Chiu, Y. T. ; Lai, Y. S. / Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints. 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. 2011. 頁 114-117 (Proceedings - Electronic Components and Technology Conference).
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abstract = "The electromigration-induced accelerate consumption of Cu pad in flip chip Sn2.6Ag solder joint was studied. The under bump metallization on the chip side was 0.5 μm Ti/0.1 μm Cu/2.0 μm Ni, and on the substrate side was 20 μm thick Cu pad. The current stressing was conducted at a current density of 1.0×104 A/cm2. The uneven consumption morphology of Cu pad formed after reflow results in local current crowding at the cathodic pad side. The merge of the small concavities gives rise to the large cavities and wavelike morphology of Cu pad. The effect of current crowding at the wave tip caused rapid consumption of Cu pad. The entire 20 μm Cu pad was consumed at the current crowding area after current stressing of 478 h at 1.0×10 4 A/cm2. A mechanism was proposed for the accelerate consumption of Cu pad due to current stressing.",
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Deng, WJ, Lin, K-L, Chiu, YT & Lai, YS 2011, Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints. 於 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011., 5898500, Proceedings - Electronic Components and Technology Conference, 頁 114-117, 2011 61st Electronic Components and Technology Conference, ECTC 2011, Lake Buena Vista, FL, United States, 11-05-31. https://doi.org/10.1109/ECTC.2011.5898500

Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints. / Deng, W. J.; Lin, Kwang-Lung; Chiu, Y. T.; Lai, Y. S.

2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. 2011. p. 114-117 5898500 (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

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Deng WJ, Lin K-L, Chiu YT, Lai YS. Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints. 於 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. 2011. p. 114-117. 5898500. (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2011.5898500