Electromigration-induced void formation at the Cu 5Zn 8/solder interface in a Cu/Sn-9Zn/Cu sandwich

Shih Ming Kuo, Kwang Lung Lin

研究成果: Article同行評審

11 引文 斯高帕斯(Scopus)

摘要

The electromigration that occurs in a Cu/Sn-9Zn/Cu sandwich was investigated for void formation at room temperature with 10 3 A/cm 2. A focused ion beam revealed that voids nucleated at the intermetallic compound (IMC)/solder interface regardless of the electron flow direction. The needle-like voids initiated at the cathode Cu 5Zn 8/solder interface due to the outward diffusion of Zn atoms in the Zn-rich phase and expanded as a result of the surface diffusion of Sn atoms upon current stressing.

原文English
頁(從 - 到)1611-1617
頁數7
期刊Journal of Electronic Materials
37
發行號10
DOIs
出版狀態Published - 2008 10月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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