Electron field emission enhancement of hybrid Cu/CuO nanowires fabricated by rapid thermal reduction of CuO nanowires

Yen Ming Juan; Shoou Jinn Chang; Han Ting Hsueh; Sin Hui Wang; Tsung Chieh Cheng; Shih Wei Huang; Cheng Liang Hsu

doi:10.1039/c5ra08330c

Electron field emission enhancement of hybrid Cu/CuO nanowires fabricated by rapid thermal reduction of CuO nanowires

Yen Ming Juan, Shoou Jinn Chang, Han Ting Hsueh, Sin Hui Wang, Tsung Chieh Cheng, Shih Wei Huang, Cheng Liang Hsu

微電子工程研究所

研究成果: Article › 同行評審

12 引文斯高帕斯（Scopus）

摘要

CuO nanowires (NWs) were grown via the thermal oxidation of Cu film deposited on a CuO/glass template. The reduction of CuO NWs was conducted at 250, 260, 270, and 280 °C in H₂ atmosphere. It was found that the surfaces of CuO NWs partially transformed into Cu via rapid thermal annealing (RTA) under H₂ atmosphere, forming hybrid Cu/CuO NWs. The field-enhancement factors of pure CuO NWs and hybrid Cu/CuO NWs prepared at 250, 260, and 270 °C were 2624, 5702, 7897, and 79 580, respectively. The results also show that the hybrid Cu/CuO NWs efficiently reduce the turn-on field from 6.4 to 0.9 V μm^-1.

原文	English
頁（從 - 到）	54220-54224
頁數	5
期刊	RSC Advances
卷	5
發行號	67
DOIs	https://doi.org/10.1039/c5ra08330c
出版狀態	Published - 2015

All Science Journal Classification (ASJC) codes

一般化學
一般化學工程

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10.1039/c5ra08330c

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title = "Electron field emission enhancement of hybrid Cu/CuO nanowires fabricated by rapid thermal reduction of CuO nanowires",

abstract = "CuO nanowires (NWs) were grown via the thermal oxidation of Cu film deposited on a CuO/glass template. The reduction of CuO NWs was conducted at 250, 260, 270, and 280 °C in H2 atmosphere. It was found that the surfaces of CuO NWs partially transformed into Cu via rapid thermal annealing (RTA) under H2 atmosphere, forming hybrid Cu/CuO NWs. The field-enhancement factors of pure CuO NWs and hybrid Cu/CuO NWs prepared at 250, 260, and 270 °C were 2624, 5702, 7897, and 79 580, respectively. The results also show that the hybrid Cu/CuO NWs efficiently reduce the turn-on field from 6.4 to 0.9 V μm-1.",

author = "Juan, {Yen Ming} and Chang, {Shoou Jinn} and Hsueh, {Han Ting} and Wang, {Sin Hui} and Cheng, {Tsung Chieh} and Huang, {Shih Wei} and Hsu, {Cheng Liang}",

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year = "2015",

doi = "10.1039/c5ra08330c",

language = "English",

volume = "5",

pages = "54220--54224",

journal = "RSC Advances",

issn = "2046-2069",

publisher = "Royal Society of Chemistry",

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TY - JOUR

T1 - Electron field emission enhancement of hybrid Cu/CuO nanowires fabricated by rapid thermal reduction of CuO nanowires

AU - Juan, Yen Ming

AU - Chang, Shoou Jinn

AU - Hsueh, Han Ting

AU - Wang, Sin Hui

AU - Cheng, Tsung Chieh

AU - Huang, Shih Wei

AU - Hsu, Cheng Liang

PY - 2015

Y1 - 2015

N2 - CuO nanowires (NWs) were grown via the thermal oxidation of Cu film deposited on a CuO/glass template. The reduction of CuO NWs was conducted at 250, 260, 270, and 280 °C in H2 atmosphere. It was found that the surfaces of CuO NWs partially transformed into Cu via rapid thermal annealing (RTA) under H2 atmosphere, forming hybrid Cu/CuO NWs. The field-enhancement factors of pure CuO NWs and hybrid Cu/CuO NWs prepared at 250, 260, and 270 °C were 2624, 5702, 7897, and 79 580, respectively. The results also show that the hybrid Cu/CuO NWs efficiently reduce the turn-on field from 6.4 to 0.9 V μm-1.

AB - CuO nanowires (NWs) were grown via the thermal oxidation of Cu film deposited on a CuO/glass template. The reduction of CuO NWs was conducted at 250, 260, 270, and 280 °C in H2 atmosphere. It was found that the surfaces of CuO NWs partially transformed into Cu via rapid thermal annealing (RTA) under H2 atmosphere, forming hybrid Cu/CuO NWs. The field-enhancement factors of pure CuO NWs and hybrid Cu/CuO NWs prepared at 250, 260, and 270 °C were 2624, 5702, 7897, and 79 580, respectively. The results also show that the hybrid Cu/CuO NWs efficiently reduce the turn-on field from 6.4 to 0.9 V μm-1.

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JF - RSC Advances

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Electron field emission enhancement of hybrid Cu/CuO nanowires fabricated by rapid thermal reduction of CuO nanowires

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