Electroplating of Ni-Cr on steel with pulse plating

K. L. Lin, C. J. Hsu, I. M. Hsu, J. T. Chang

研究成果: Article同行評審

39 引文 斯高帕斯(Scopus)

摘要

It has been difficult to electrolytically obtain crack- free chromium plating because of the high stresses caused by several factors. Accordingly, electroplating of nickel- chromium also encounters a similar problem. Cracks in chromium- containing plating was ascribed, in a certain sense, to the formation of a hydride formed through hydrogen adsorption from the electrolyte. A periodical pulse reverse plating current would enhance the release of hydrogen and hence the elimination of cracking. The present work describes a successful process for obtaining crack- free nickel- chromium plating and the effects of experimental variables on plating compositions.

原文English
頁(從 - 到)359-361
頁數3
期刊Journal of Materials Engineering and Performance
1
發行號3
DOIs
出版狀態Published - 1992 六月

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 材料力學
  • 機械工業

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