Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint

Wei Yu Chen, Tsung Chieh Chiu, Kwang Lung Lin, Yi Shao Lai

研究成果: Article同行評審

23 引文 斯高帕斯(Scopus)

摘要

The electrorecrystallization, recrystallization driven by electrical current stressing, of Cu 6Sn 5 intermetallic compound occurs in a Sn0.7Cu flip chip solder bump. The Cu 6Sn 5 dissolves in Sn0.7Cu at 1.0 × 10 4 A/cm 2 of current stressing under 150°C. The Cu flux in the solder joint, driven by the combination force of thermal gradient and electromigration, flows toward the cold side of the solder joint. The segregation of Cu results in recrystallization and thus redistribution of IMC at the cold side of the solder joint after current stops.

原文English
頁(從 - 到)40-43
頁數4
期刊Intermetallics
26
DOIs
出版狀態Published - 2012 七月

All Science Journal Classification (ASJC) codes

  • 化學 (全部)
  • 材料力學
  • 機械工業
  • 金屬和合金
  • 材料化學

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