Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition

Wen Ta Tsai, Jun Jie Yang, Chi Lin Cheng

研究成果: Conference contribution

原文English
主出版物標題Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016
發行者Avestia Publishing
ISBN(列印)9781927877197
DOIs
出版狀態Published - 2016 一月 1
事件Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016 - Prague, Czech Republic
持續時間: 2016 四月 12016 四月 2

出版系列

名字World Congress on Recent Advances in Nanotechnology
ISSN(電子)2371-5308

Other

OtherProceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016
國家Czech Republic
城市Prague
期間16-04-0116-04-02

All Science Journal Classification (ASJC) codes

  • Biotechnology
  • Biomedical Engineering
  • Mechanical Engineering
  • Management, Monitoring, Policy and Law
  • Pollution
  • Biomaterials
  • Modelling and Simulation
  • Histology

引用此

Tsai, W. T., Yang, J. J., & Cheng, C. L. (2016). Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. 於 Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016 (World Congress on Recent Advances in Nanotechnology). Avestia Publishing. https://doi.org/10.11159/icnnfc16.119