Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition

Wen Ta Tsai, Jun Jie Yang, Chi Lin Cheng

研究成果: Conference contribution

原文English
主出版物標題Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016
發行者Avestia Publishing
ISBN(列印)9781927877197
DOIs
出版狀態Published - 2016 一月 1
事件Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016 - Prague, Czech Republic
持續時間: 2016 四月 12016 四月 2

出版系列

名字World Congress on Recent Advances in Nanotechnology
ISSN(電子)2371-5308

Other

OtherProceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016
國家Czech Republic
城市Prague
期間16-04-0116-04-02

指紋

Carbon Dioxide
Aspect Ratio
Aspect ratio
Carbon dioxide
carbon dioxide
Metals
metal

All Science Journal Classification (ASJC) codes

  • Biotechnology
  • Biomedical Engineering
  • Mechanical Engineering
  • Management, Monitoring, Policy and Law
  • Pollution
  • Biomaterials
  • Modelling and Simulation
  • Histology

引用此文

Tsai, W. T., Yang, J. J., & Cheng, C. L. (2016). Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. 於 Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016 (World Congress on Recent Advances in Nanotechnology). Avestia Publishing. https://doi.org/10.11159/icnnfc16.119
Tsai, Wen Ta ; Yang, Jun Jie ; Cheng, Chi Lin. / Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016. Avestia Publishing, 2016. (World Congress on Recent Advances in Nanotechnology).
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Tsai, WT, Yang, JJ & Cheng, CL 2016, Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. 於 Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016. World Congress on Recent Advances in Nanotechnology, Avestia Publishing, Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016, Prague, Czech Republic, 16-04-01. https://doi.org/10.11159/icnnfc16.119

Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. / Tsai, Wen Ta; Yang, Jun Jie; Cheng, Chi Lin.

Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016. Avestia Publishing, 2016. (World Congress on Recent Advances in Nanotechnology).

研究成果: Conference contribution

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Tsai WT, Yang JJ, Cheng CL. Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition. 於 Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016. Avestia Publishing. 2016. (World Congress on Recent Advances in Nanotechnology). https://doi.org/10.11159/icnnfc16.119