Endurance of NiCuZn ferrite chip inductors

Cheng Su Chiang, Ying Lai Chai, Shih Feng Chien, Wen Hsi Lee

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

摘要

Plating conditions significantly affect the reliability of components. Matter exchanges between the surface of components and the plating solution often occur during plating process owing to the corrosive characteristics of the latter, and this will lead to the production of excess ions and electrons and, subsequently, to electromigration. Reducing the plating current and shortening the plating time can inhibit the corrosion associated with the plating solution, and thus lengthen the life of components. Another approach is to increase sintering temperature, which can enhance the resistance of the surfaces of components to the plating solution, and thus also increase their lifespan. With regard to the cause of electromigration, the electric field might arise from the interaction between the magnetic field and the joule heat generated by the current load and ambient temperature during the test of the component lifespan.

原文English
文章編號123001
期刊Japanese Journal of Applied Physics
54
發行號12
DOIs
出版狀態Published - 2015 十二月

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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