Enhanced Thermal Stability in SiO2/Carbon Filler Derived from Rice Husk via Microwave Treatment for Electronic Packaging Application

Ya Yu Hsieh, Chin Zen Huang, Yun Chih Tsai, Hong Ping Lin, Chun Han Hsu, Aswaghosh Loganathan

研究成果: Article

1 引文 (Scopus)

摘要

Here we report the effect of microwave treatment on a silica–carbon (SiO2 /C) filler derived from rice husk and the function of the microwave-treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO2 /C filler upon microwave treatment. X-ray diffraction analysis indicated partial SiC formation after the microwave treatment. For packaging applications, compared to that of the pure epoxy polymer, the thermal conductivity of the epoxy–SiO2 /C composite was improved by 178% at 40 wt % content of the microwave-treated SiO2 /C filler. Furthermore, an improvement of 149% in storage modulus and 17.6°C in glass transition temperature of the epoxy–SiO2 /C composites was realized. The improvement in thermal stability of SiO2 /C filler could be achieved via a simple microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials.

原文English
頁(從 - 到)1035-1040
頁數6
期刊Journal of the Chinese Chemical Society
64
發行號9
DOIs
出版狀態Published - 2017 九月

指紋

Electronics packaging
Fillers
Thermodynamic stability
Carbon
Microwaves
Packaging materials
Composite materials
X ray diffraction analysis
Thermogravimetric analysis
Thermal conductivity
Packaging
Polymers
Elastic moduli

All Science Journal Classification (ASJC) codes

  • Chemistry(all)

引用此文

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title = "Enhanced Thermal Stability in SiO2/Carbon Filler Derived from Rice Husk via Microwave Treatment for Electronic Packaging Application",
abstract = "Here we report the effect of microwave treatment on a silica–carbon (SiO2 /C) filler derived from rice husk and the function of the microwave-treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO2 /C filler upon microwave treatment. X-ray diffraction analysis indicated partial SiC formation after the microwave treatment. For packaging applications, compared to that of the pure epoxy polymer, the thermal conductivity of the epoxy–SiO2 /C composite was improved by 178{\%} at 40 wt {\%} content of the microwave-treated SiO2 /C filler. Furthermore, an improvement of 149{\%} in storage modulus and 17.6°C in glass transition temperature of the epoxy–SiO2 /C composites was realized. The improvement in thermal stability of SiO2 /C filler could be achieved via a simple microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials.",
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T1 - Enhanced Thermal Stability in SiO2/Carbon Filler Derived from Rice Husk via Microwave Treatment for Electronic Packaging Application

AU - Hsieh, Ya Yu

AU - Huang, Chin Zen

AU - Tsai, Yun Chih

AU - Lin, Hong Ping

AU - Hsu, Chun Han

AU - Loganathan, Aswaghosh

PY - 2017/9

Y1 - 2017/9

N2 - Here we report the effect of microwave treatment on a silica–carbon (SiO2 /C) filler derived from rice husk and the function of the microwave-treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO2 /C filler upon microwave treatment. X-ray diffraction analysis indicated partial SiC formation after the microwave treatment. For packaging applications, compared to that of the pure epoxy polymer, the thermal conductivity of the epoxy–SiO2 /C composite was improved by 178% at 40 wt % content of the microwave-treated SiO2 /C filler. Furthermore, an improvement of 149% in storage modulus and 17.6°C in glass transition temperature of the epoxy–SiO2 /C composites was realized. The improvement in thermal stability of SiO2 /C filler could be achieved via a simple microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials.

AB - Here we report the effect of microwave treatment on a silica–carbon (SiO2 /C) filler derived from rice husk and the function of the microwave-treated filler in an epoxy matrix for electronic packaging applications. Thermogravimetric analysis revealed improved thermal stability of the SiO2 /C filler upon microwave treatment. X-ray diffraction analysis indicated partial SiC formation after the microwave treatment. For packaging applications, compared to that of the pure epoxy polymer, the thermal conductivity of the epoxy–SiO2 /C composite was improved by 178% at 40 wt % content of the microwave-treated SiO2 /C filler. Furthermore, an improvement of 149% in storage modulus and 17.6°C in glass transition temperature of the epoxy–SiO2 /C composites was realized. The improvement in thermal stability of SiO2 /C filler could be achieved via a simple microwave treatment, which in turn enhanced the thermal stability, thermal conduction, and thermomechanical strength of the electronic packaging materials.

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