Evolution of Ag₃Sn intermetallic compounds during solidification of eutectic Sn-3.5Ag solder

Engineering & Materials Science

• Intermetallics 85%
• Eutectics 85%
• Soldering alloys 79%
• Solidification 78%
• Needles 56%
• Cooling 56%
• Nucleation 28%

Chemical Compounds

• Solder 100%
• Solidification 89%
• Intermetallic Compound 86%
• Eutectics 82%
• Cooling 71%
• Nucleation 22%
• Time 9%