Experimental study on the nanoindentation of thin copper films from deep submicron to nano-scale

Y. R. Jeng, C. M. Tan, C. C. Su, S. C. Cheng, C. Y. Cheng

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

This study uses the nanoindentation technique to evaluate the mechanical properties of thin copper films at indentation depths measured in the order of nanometers. Copper films with various thicknesses are deposited on a single crystal silicon wafer with a (100) orientation and on a polymethylmethacrylate (PMMA) substrate, respectively. The experimental results show that for soft thin films on a hard substrate, the substrate effect is negligible when the indentation depth is less than 20% of the film thickness. However, the results suggest that hard films on a soft substrate should be treated as a composite system in indentation because the substrate effect is significant. Finally, the results reveal that a significant indentation size effect exists for thin films with a thickness of less than 100nm. A number of possible reasons for the depth dependence of the hardness properties at ultra-shallow indentation depths are proposed and discussed.

原文English
頁(從 - 到)507-511
頁數5
期刊Journal of Mechanics
28
發行號3
DOIs
出版狀態Published - 2012 九月

All Science Journal Classification (ASJC) codes

  • 凝聚態物理學
  • 機械工業
  • 應用數學

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