Fabrication and design of a heat transfer micro channel system at low temperature process by MEMS technique

C. W. Liu, Chie Gau, C. S. Yang, B. T. Dai

研究成果: Paper同行評審

1 引文 斯高帕斯(Scopus)

摘要

The current work provides a low temperature fabrication technique for a micro channel system that a low thermal conductivity material can be used to form the channel wall. This channel can provide a uniform heat flux boundary condition and a well insulation on the wall to prevent heat loss from the channel to the outside ambient. Therefore, detailed micro-scale flow and heat transfer process and information along the channel can be studied. Design consideration and fabrication techniques involved in this processes will be discussed. A final measurement for the validation of the heaters and the sensors fabricated and a study of the heat transfer coefficient distributions inside the micro channel will be presented.

原文English
頁面623-626
頁數4
出版狀態Published - 2004 十二月 1
事件IEEE Sensors 2004 - Vienna, Austria
持續時間: 2004 十月 242004 十月 27

Other

OtherIEEE Sensors 2004
國家/地區Austria
城市Vienna
期間04-10-2404-10-27

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程

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