Fabrication and simulation of PDMS assisted CO2 laser ablation

Chen-Kuei Chung, S. L. Lin, K. C. Chang, H. Y. Wang

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

The traditional glass forming using laser ablation in air would produce many kinds of defects such as bulge, debris, crack and scorch. In this paper, we have applied the method of PDMS assisted laser processing to reduce the temperature gradient, heat-affect zone region for achieving crack-free glass ablation. The laser power of 15 W, PDMS thickness of 150 μm and scanning speed of 228 and 342 mm/s were used for ablation to obtain a good quality of cutting surface which was clear, less bugle, no crack and scorch in this technique. The alpha-step measured profile showed that the much reduced bugle height around the rims of groove was about 1.0± 0.5 μm in case of 150 μm poly-dimethylsiloxane (PDMS) thickness while that in air was 15.1 μm. The ANSYS software was also used to analyze the temperature distribution and thermal stress field in air and PDMS ambient during glass ablation. The smaller temperature gradient observed in PDMS-assisted ablation had the smaller heat-affect zone and diminished the crack formation during processing. In contrast, the higher temperature gradient in air induced higher stress for creating crack and scorch on the surface.

原文English
主出版物標題2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
頁面650-653
頁數4
DOIs
出版狀態Published - 2010 十一月 29
事件5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010 - Xiamen, China
持續時間: 2010 一月 202010 一月 23

出版系列

名字2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010

Other

Other5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
國家China
城市Xiamen
期間10-01-2010-01-23

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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