Fabrication of 0.15-μ Γ-shaped Gate In0.52 Al0.48As/In0.6Ga0.4 metamorphic HEMTs using DUV lithography and tilt dry-etching technique

Yi Chung Lien, Szu Hung Chen, Edward Yi Chang, Ching Ting Lee, Li Hsin Chu, Chia Yuan Chang

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)


An In0.52Al0.48As/In0.6Ga0.4 As metamorphic high-electron mobility transistor (MHEMT) with 0.15-μΓ-shaped gate using deep ultraviolet lithography and tilt dry-etching technique is demonstrated. The developed submicrometer gate technology is simple and of low cost as compared to the conventional E-beam lithography or other hybrid techniques. The gate length is controllable by adjusting the tilt angle during the dry-etching process. The fabricated 0.15-μ In0.52Al0.48 As/In0.6Ga0.4 MHEMT using this novel technique shows a saturated drain-source current of 680 mA/mm and a transconductance of 728 mS/mm. The fT and fmaxof the MHEMT are 130 and 180 GHz, respectively. The developed technique is a promising low-cost alternative to the conventional submicrometer E-beam gate technology used for the fabrication for GaAs MHEMTs and monolithic microwave integrated circuits.

頁(從 - 到)93-95
期刊IEEE Electron Device Letters
出版狀態Published - 2007 二月

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

指紋 深入研究「Fabrication of 0.15-μ Γ-shaped Gate In<sub>0.52</sub> Al<sub>0.48</sub>As/In<sub>0.6</sub>Ga<sub>0.4</sub> metamorphic HEMTs using DUV lithography and tilt dry-etching technique」主題。共同形成了獨特的指紋。