Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging

Wei Lan Chiu, Chia Ling Lu, Han Wen Lin, Chien Min Liu, Yi Sa Huang, Tien Lin Lu, Tao Chi Liu, Hsiang Yao Hsiao, Chih Chen, Jui-Chao Kuo, King Ning Tu

研究成果: Conference contribution

摘要

Due to the thousands of microbumps on a chip for 3D ICs, the precise control of the microstructure of all the material is required. The nearly <111>-oriented nanotwinned and fine-grained Cu was electroplated on a Si wafer surface and annealed at 400-500 °C for 1 h, many extremely large <100>-oriented Cu crystals with grain sizes ranging from 200 to 400 μm were obtained. The <111>-oriented Cu grains were transformed into super-large <100>-oriented grains after the annealing. In addition, we patterned the <111>-oriented Cu films into pad arrays of 25 to 100 μm in diameter and annealed the nanotwinned Cu pads with same conditions. An array of <100>-oriented single crystals Cu pads can be obtained. Otherwise, single-crystal nano-wire growth displays a process by one-dimensional anisotropic growth, in which the growth along the axial direction is much faster than in the radial direction. This study reported here a bulk-type two-dimensional crystal growth of an array of numerous <100>-oriented single crystals of Cu on Si. The growth process in 3D IC has the potential for microbump applications packaging technology.

原文English
主出版物標題ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
發行者Institute of Electrical and Electronics Engineers Inc.
頁面518-522
頁數5
ISBN(電子)9784904090138
DOIs
出版狀態Published - 2015 五月 20
事件2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
持續時間: 2015 四月 142015 四月 17

出版系列

名字ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
國家Japan
城市Kyoto
期間15-04-1415-04-17

    指紋

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

引用此

Chiu, W. L., Lu, C. L., Lin, H. W., Liu, C. M., Huang, Y. S., Lu, T. L., ... Tu, K. N. (2015). Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging. 於 ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (頁 518-522). [7111069] (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP-IAAC.2015.7111069