Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging

Wei Lan Chiu, Chia Ling Lu, Han Wen Lin, Chien Min Liu, Yi Sa Huang, Tien Lin Lu, Tao Chi Liu, Hsiang Yao Hsiao, Chih Chen, Jui Chao Kuo, King Ning Tu

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

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Engineering & Materials Science