Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

Hidetoshi Shinohara; Jun Mizuno; Fumihiko Kitagawa; Koji Otsuka; Shuichi Shoji

Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

Hidetoshi Shinohara, Jun Mizuno, Fumihiko Kitagawa, Koji Otsuka, Shuichi Shoji

智慧與永續製造學位學程

研究成果: Paper › 同行評審

3 引文斯高帕斯（Scopus）

摘要

In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.

原文	English
頁面	158-160
頁數	3
出版狀態	Published - 2006
事件	10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006 - Tokyo, Japan 持續時間: 2006 11月 5 → 2006 11月 9

Other

Other	10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006
國家/地區	Japan
城市	Tokyo
期間	06-11-05 → 06-11-09

All Science Journal Classification (ASJC) codes

化學工程（雜項）
生物工程

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title = "Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding",

abstract = "In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.",

author = "Hidetoshi Shinohara and Jun Mizuno and Fumihiko Kitagawa and Koji Otsuka and Shuichi Shoji",

year = "2006",

language = "English",

pages = "158--160",

note = "10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006 ; Conference date: 05-11-2006 Through 09-11-2006",

}

TY - CONF

T1 - Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

AU - Shinohara, Hidetoshi

AU - Mizuno, Jun

AU - Kitagawa, Fumihiko

AU - Otsuka, Koji

AU - Shoji, Shuichi

PY - 2006

Y1 - 2006

N2 - In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.

AB - In this paper, a PMMA (poly-methyl methacrylate) microchip, which has shallow dams of about 5 μm gaps, was fabricated and evaluated. Accurate dimension control of the micro-channels was realized by not only optimizing hot embossing conditions but also employing low temperature plasma activated bonding.

UR - http://www.scopus.com/inward/record.url?scp=84902472451&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84902472451&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:84902472451

SP - 158

EP - 160

T2 - 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2006

Y2 - 5 November 2006 through 9 November 2006

ER -

Fabrication of highly dimension controlled PMMA microchip by hot embossing and low temperature direct bonding

摘要

Other

All Science Journal Classification (ASJC) codes

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