Micropatterns of silica were fabricated on interdigitated array (IDA) electrode used to be the insulting layer of inner electrode of multilayer ceramic capacitor (MLCC) by electrophoretic deposition. A three-electrode circuit system was applied to deposit the silica nanoparticle on the silver IDA electrode. The three-electrode system shows better deposition selectively of interval. Smaller IDA electrode spacing performed faster deposition rate and lower applied voltage. A crack-free film of silica was deposited at 10 V applied voltage for 20 s and sintered at 800°C. The resistance of micropattern film is 7 × 109 ohm. The adhesion between silica layer and electrode was improved after sintering.
|頁（從 - 到）||528-533|
|出版狀態||Published - 2012 一月 1|
|事件||2011 IUMRS International Conference in Asia, ICA 2011 - Taipei, Taiwan|
持續時間: 2011 九月 19 → 2011 九月 22
All Science Journal Classification (ASJC) codes