Fabrication of three-dimensional and submicrometer-scaled microstructures based on metal contact printing and silicon bulk machining

Kuo Lun Kao, Cho Wei Chang, Yung Chun Lee

研究成果: Article同行評審

摘要

This paper describes a method that contains a series of processes for producing three-dimensional (3-D) microstructures with a feature size in the submicrometer scale. It starts from using a metal contact printing lithography to pattern a thin metal film on the surface of a (100) silicon substrate. The metal film has a hole-array pattern with a hole diameter ranging from 300 nm to 800 nm and is used as an etching mask for silicon bulk machining to create concave pyramid-shaped surface microstructures. Using this bulk-machined silicon substrate as a template, polymer 3-D microstructures are replicated on top of a silicon dioxide (SiO2) layer. Finally, through a dry etching process, 3-D microstructures with a profile similar to the replicated polymer microstructures are formed on the SiO2 layer. Potential applications of these fabricated SiO2 microstructures in the light-emitting diode industry will be addressed.

原文English
文章編號023008
期刊Journal of Micro/Nanolithography, MEMS, and MOEMS
13
發行號2
DOIs
出版狀態Published - 2014 4月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 機械工業
  • 電氣與電子工程

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