TY - GEN
T1 - Fabrications of electroless Ni-P composite coatings before and after annealing and tribological analyses
AU - Chang, Chang Shuo
AU - Hou, Kung Hsu
AU - Ger, Ming Der
AU - Chung, Chen Kuei
AU - Lin, Jen Fin
N1 - Publisher Copyright:
© 2015 Trans Tech Publications, Switzerland.
Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2015
Y1 - 2015
N2 - In the present study, SiC reinforced particles were introduced to the Ni-P plating bath, and developed high SiC content composite coatings. Thin films nature properties and mechanical performances were evaluated well. The results showed that the Ni-P alloy embedded SiC particles formed a few cavities, and reduced coatings hardness and wear resistance in as-plated condition. After 400°C heat-treatment, Ni3P crystalline phase formed and reached the max hardness, and conducted excellent trybological performances. SiC particles were decoposited in 600°C and reacted with Ni to form Ni3Si and Ni5Si2, caused the decreasing in hardness.
AB - In the present study, SiC reinforced particles were introduced to the Ni-P plating bath, and developed high SiC content composite coatings. Thin films nature properties and mechanical performances were evaluated well. The results showed that the Ni-P alloy embedded SiC particles formed a few cavities, and reduced coatings hardness and wear resistance in as-plated condition. After 400°C heat-treatment, Ni3P crystalline phase formed and reached the max hardness, and conducted excellent trybological performances. SiC particles were decoposited in 600°C and reacted with Ni to form Ni3Si and Ni5Si2, caused the decreasing in hardness.
UR - https://www.scopus.com/pages/publications/84930172658
UR - https://www.scopus.com/pages/publications/84930172658#tab=citedBy
U2 - 10.4028/www.scientific.net/KEM.642.286
DO - 10.4028/www.scientific.net/KEM.642.286
M3 - Conference contribution
AN - SCOPUS:84930172658
T3 - Key Engineering Materials
SP - 286
EP - 291
BT - Tribology Engineering
A2 - Hwang, Yunn-Lin
A2 - Horng, Jeng-Haur
A2 - Wei, Chin-Chung
PB - Trans Tech Publications Ltd
T2 - International Conference on Engineering Tribology Technology, ICETT 2014
Y2 - 21 November 2014 through 23 November 2014
ER -