Failure analysis of halogen-free printed circuit board assembly under board-level drop test

Hung Jen Chang, Chau Jie Zhan, Tao Chih Chang, Jung-Hua Chou

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn 4.0Ag 0.5Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn 1.0Ag 0.5Cu solder paste on the Cu pad surfaces of either organic solderable preservative (OSP) or electroless nickel immersion gold (ENIG). The assembly was tested for the effect of the formation extent of Ag 3Sn intermetallic compound. Afterward a board-level pulse-controlled drop test was conducted on the as-reflowed assemblies according to the JESD22-B110 and JESD22-B111 standards, the impact performance of various surface finished halogen-free printed circuit board assembly was evaluated. The test results showed that most of the fractures occurred around the pad on the test board first. Then cracks propagated across the outer build-up layer. Finally, the inner copper trace was fractured due to the propagated cracks, resulting in the failure of the PCB side. Interfacial stresses numerically obtained by the transient stress responses supported the test observation as the simulated initial crack position was the same as that observed.

原文English
文章編號011011
期刊Journal of Electronic Packaging, Transactions of the ASME
134
發行號1
DOIs
出版狀態Published - 2012 四月 2

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 材料力學
  • 電腦科學應用
  • 電氣與電子工程

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