Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test

Yeh Hsiu Liu, Chiang Ming Chuang, Kwang Lung Lin

研究成果: Article同行評審

13 引文 斯高帕斯(Scopus)

摘要

The shear strength, intermetallic compound formation, and failure mechanism of high-lead solder (5Sn-95Pb) bump on flip chip under bump metallurgy, Al/Ni(V)/Cu, were investigated after thermal cycling, multiple reflow, and high-temperature aging. Two kinds of intermetallic compound, Cu3Sn and AlxNiy, were found at the interface. The Cu3Sn was formed between the solder and Ni(V) layer while AlxNiy was formed between Ni(V) and Al layer. The formation of the Cu3Sn compound will not affect the shear strength, 27-30 g, of the solder bump even after a high temperature long time aging test. However, the shear strength after the 30th reflow drops to less than 25 g, ascribed to the formation of a brittle compound, AlxNiy. The failure modes of the solder bump upon shear test were also discussed.

原文English
頁(從 - 到)2471-2477
頁數7
期刊Journal of Materials Research
19
發行號8
DOIs
出版狀態Published - 2004 八月

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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