Fast Steady-State Thermal Analysis

Lih Yih Chiou, Chun Hao Chang, Liang Ying Lu, Wei Hsuan Yang, Yeong Jar Chang, Juin Ming Lu

研究成果: Conference contribution

摘要

Thermal issues are gaining critical in system-on-a-chip. We propose a two-stage thermal analysis approach using big and little matrix operations with a matrix compression method in general successive over-relaxation (SOR) to speed up the analysis of a steady-state thermal profile, referred to as TSA. Experimental results show that the analysis performance of TSA is faster than the general SOR by 2145× in average and faster than the popular Supernodal LU (SuperLU) at least by 1.55× for large size of sparse matrices.

原文English
主出版物標題Proceedings - International SoC Design Conference 2018, ISOCC 2018
發行者Institute of Electrical and Electronics Engineers Inc.
頁面15-16
頁數2
ISBN(電子)9781538679609
DOIs
出版狀態Published - 2018 7月 2
事件15th International SoC Design Conference, ISOCC 2018 - Daegu, Korea, Republic of
持續時間: 2018 11月 122018 11月 15

出版系列

名字Proceedings - International SoC Design Conference 2018, ISOCC 2018

Conference

Conference15th International SoC Design Conference, ISOCC 2018
國家/地區Korea, Republic of
城市Daegu
期間18-11-1218-11-15

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程
  • 電子、光磁材料

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