FEA of thermal warpage in ball grid array with consideration of molding compound residual strain compared to experimental measurements

Nino Rigo Emil Lim, Richard Dimagiba, Aristotle Ubando, Jeremias Gonzaga, Gerardo Augusto

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

As semiconductor devices continue to advance in terms of having smaller and denser designs, the semiconductor packages, in turn, must keep up with the changes to prevent the semiconductor chips from damages caused by internal and external factors. In this paper, a 3D finite element model was developed based on the dimensions of the actual Ball Grid Array. The material properties applied are derived from a previous study by Tsai, et al in 2008. The model was subjected to the same thermal loadings as the experiment and was compared at each temperature level. A quarter model was made and appropriate constraints were applied to determine the proper thermal warpage calculations. The molding compound residual strain was implemented using the command object feature or the Mechanical ANSYS Parametric Design Language (MAPDL). A mesh independence test was also done to determine at which mesh setting yields a stable warpage calculation. The results from the 3D simulation compared to the experimental measurements and were determined to be reasonably consistent. This validates and verifies the geometry, material properties, and boundary conditions applied to the developed 3D FEM that would be necessary for further Finite Element Analysis (FEA).

原文English
主出版物標題2018 IEEE 10th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment and Management, HNICEM 2018
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781538677674
DOIs
出版狀態Published - 2019 3月 12
事件10th IEEE International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment and Management, HNICEM 2018 - Baguio City, Philippines
持續時間: 2018 11月 292018 12月 2

出版系列

名字2018 IEEE 10th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment and Management, HNICEM 2018

Conference

Conference10th IEEE International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment and Management, HNICEM 2018
國家/地區Philippines
城市Baguio City
期間18-11-2918-12-02

All Science Journal Classification (ASJC) codes

  • 資訊系統
  • 電氣與電子工程
  • 人機介面
  • 人工智慧
  • 通訊
  • 硬體和架構

指紋

深入研究「FEA of thermal warpage in ball grid array with consideration of molding compound residual strain compared to experimental measurements」主題。共同形成了獨特的指紋。

引用此