Finite-element analysis of the mechanical behavior of Au/Cu and Cu/Au multilayers on silicon substrate under nanoindentation

Tong Hong Wang, Te Hua Fang, Yu-Cheng Lin

研究成果: Article同行評審

15 引文 斯高帕斯(Scopus)

摘要

Finite-element analysis of the nanoindentation into Au/Cu and Cu/Au multilayers was performed to deduce their mechanical characteristics from nanoindentation response. Different bilayer thicknesses, numbers, and sequences were studied using the load-displacement curve, hardness, indentation, and the residual surface profile as well as the von Mises equivalent stress. The characteristics of the multilayers were found to be dispersed between the Au and Cu. Nevertheless, if the indentation depth is smaller than the uppermost individual layer thickness of the multilayers, the intrinsic properties can be obtained. Using the von Mises equivalent stress as a failure criterion, the results showed that thinner multilayers would induce a greater potential of shear banding deformation.

原文English
頁(從 - 到)457-463
頁數7
期刊Applied Physics A: Materials Science and Processing
90
發行號3
DOIs
出版狀態Published - 2008 三月 1

All Science Journal Classification (ASJC) codes

  • 化學 (全部)
  • 材料科學(全部)

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