Finite-element analysis of thermal stresses in a silicon pressure sensor for various die-mount materials

Yu Cheng Lin, Peter J. Hesketh, John P. Schuster

研究成果: Article同行評審

6 引文 斯高帕斯(Scopus)

摘要

The performance of a silicon micromachined pressure sensor can be significantly affected by the die-attach material and the mounting configuration of the die in its package. Packaging stresses transmitted to the piezoresistive element implanted in the sensing die can induce an error in the voltage output of the sensor. A finite-element model is developed to analyse the effects of different die-mounting configurations, die-attach materials and sensor-element constraints. The model calculates the temperature-induced stress affecting the piezoresistive element ion-implanted on the surface of the pressure-sensing die. Aluminium nitride produces the minimum offset. The 110 mil glass constraint provides better mechanical isolation from the stresses produced by the thermal mismatch between the silicon/glass component and the substrate.

原文English
頁(從 - 到)145-149
頁數5
期刊Sensors and Actuators: A. Physical
44
發行號2
DOIs
出版狀態Published - 1994 八月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 儀器
  • 凝聚態物理學
  • 表面、塗料和薄膜
  • 金屬和合金
  • 電氣與電子工程

指紋

深入研究「Finite-element analysis of thermal stresses in a silicon pressure sensor for various die-mount materials」主題。共同形成了獨特的指紋。

引用此