Finite element method simulation of photoinductive imaging for cracks

C. C. Tai, Y. L. Pan

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

In this paper, the numerical simulations of photoinductive imaging (PI) method have been performed using the finite element method (FEM) with the 2D transient to characterize corner cracks at the edge of a bolt hole. The PI imaging results have higher spatial resolution in the area of the defect in 2D models as compared with the conventional eddy current (EC) images. The FEM simulation results of 0.5-mm rectangular defects are showed and analyzed. The dependencies of PI signals on EC frequencies and temperature of the thermal spot are also examined. The results demonstrate that the PI method is applicable to examine the geometric shape of corner cracks.

原文English
頁(從 - 到)53-61
頁數9
期刊Progress in Electromagnetics Research Letters
2
DOIs
出版狀態Published - 2008

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料

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