| 原文 | English |
|---|---|
| 文章編號 | 8097094 |
| 頁（從 - 到） | iv |
| 期刊 | ITC-Asia 2017 - International Test Conference in Asia |
| DOIs | |
| 出版狀態 | Published - 2017 十一月 3 |
| 事件 | 1st International Test Conference in Asia, ITC-Asia 2017 - Taipei, Taiwan 持續時間: 2017 九月 13 → 2017 九月 15 |
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Automotive Engineering
- Electrical and Electronic Engineering
- Safety, Risk, Reliability and Quality
引用此文
Wu, C. W., Lee, K. J., Wang, L. C., & Huang, S. Y. (2017). Foreword. ITC-Asia 2017 - International Test Conference in Asia, iv. [8097094]. https://doi.org/10.1109/ITC-ASIA.2017.8097094
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Wu, CW, Lee, KJ, Wang, LC & Huang, SY 2017, 'Foreword', ITC-Asia 2017 - International Test Conference in Asia, 頁 iv. https://doi.org/10.1109/ITC-ASIA.2017.8097094
Foreword. / Wu, Cheng Wen; Lee, Kuen Jong; Wang, Li C.; Huang, Shi Yu.
於: ITC-Asia 2017 - International Test Conference in Asia, 03.11.2017, p. iv.研究成果: Editorial
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Wu CW, Lee KJ, Wang LC, Huang SY. Foreword. ITC-Asia 2017 - International Test Conference in Asia. 2017 11月 3;iv. 8097094. https://doi.org/10.1109/ITC-ASIA.2017.8097094