Foreword: Pb-free solders and emerging interconnect and packaging technologies

Kwang-Lung Lin, Sung K. Kang, Jenq Gong Duh, Andre Lee, Thomas Bieler, Laura Turbini, Rajen Sidhu, Fu Guo, Iver Anderson

研究成果: Editorial

3 引文 (Scopus)
原文English
頁數1
期刊Journal of Electronic Materials
39
發行號12
DOIs
出版狀態Published - 2010 十二月 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

引用此文

Lin, Kwang-Lung ; Kang, Sung K. ; Duh, Jenq Gong ; Lee, Andre ; Bieler, Thomas ; Turbini, Laura ; Sidhu, Rajen ; Guo, Fu ; Anderson, Iver. / Foreword : Pb-free solders and emerging interconnect and packaging technologies. 於: Journal of Electronic Materials. 2010 ; 卷 39, 編號 12.
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Lin, K-L, Kang, SK, Duh, JG, Lee, A, Bieler, T, Turbini, L, Sidhu, R, Guo, F & Anderson, I 2010, 'Foreword: Pb-free solders and emerging interconnect and packaging technologies', Journal of Electronic Materials, 卷 39, 編號 12. https://doi.org/10.1007/s11664-010-1389-8

Foreword : Pb-free solders and emerging interconnect and packaging technologies. / Lin, Kwang-Lung; Kang, Sung K.; Duh, Jenq Gong; Lee, Andre; Bieler, Thomas; Turbini, Laura; Sidhu, Rajen; Guo, Fu; Anderson, Iver.

於: Journal of Electronic Materials, 卷 39, 編號 12, 01.12.2010.

研究成果: Editorial

TY - JOUR

T1 - Foreword

T2 - Pb-free solders and emerging interconnect and packaging technologies

AU - Lin, Kwang-Lung

AU - Kang, Sung K.

AU - Duh, Jenq Gong

AU - Lee, Andre

AU - Bieler, Thomas

AU - Turbini, Laura

AU - Sidhu, Rajen

AU - Guo, Fu

AU - Anderson, Iver

PY - 2010/12/1

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DO - 10.1007/s11664-010-1389-8

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JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

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