Foreword: Pb-free solders and emerging interconnect and packaging technologies

Kwang Lung Lin; Sung K. Kang; Jenq Gong Duh; Andre Lee; Thomas Bieler; Laura Turbini; Rajen Sidhu; Fu Guo; Iver Anderson

doi:10.1007/s11664-010-1389-8

Foreword: Pb-free solders and emerging interconnect and packaging technologies

Kwang Lung Lin, Sung K. Kang, Jenq Gong Duh, Andre Lee, Thomas Bieler, Laura Turbini, Rajen Sidhu, Fu Guo, Iver Anderson

研究成果: Editorial › 同行評審

3 引文斯高帕斯（Scopus）

原文	English
頁（從 - 到）	2503
頁數	1
期刊	Journal of Electronic Materials
卷	39
發行號	12
DOIs	https://doi.org/10.1007/s11664-010-1389-8
出版狀態	Published - 2010 12月

All Science Journal Classification (ASJC) codes

電子、光磁材料
凝聚態物理學
電氣與電子工程
材料化學

存取文件

10.1007/s11664-010-1389-8

其它文件與鏈接

引用此

@article{f7ed9350d53444ee8228c9d1d2807f9d,

title = "Foreword: Pb-free solders and emerging interconnect and packaging technologies",

author = "Lin, {Kwang Lung} and Kang, {Sung K.} and Duh, {Jenq Gong} and Andre Lee and Thomas Bieler and Laura Turbini and Rajen Sidhu and Fu Guo and Iver Anderson",

year = "2010",

month = dec,

doi = "10.1007/s11664-010-1389-8",

language = "English",

volume = "39",

pages = "2503",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "12",

}

TY - JOUR

T1 - Foreword

T2 - Pb-free solders and emerging interconnect and packaging technologies

AU - Lin, Kwang Lung

AU - Kang, Sung K.

AU - Duh, Jenq Gong

AU - Lee, Andre

AU - Bieler, Thomas

AU - Turbini, Laura

AU - Sidhu, Rajen

AU - Guo, Fu

AU - Anderson, Iver

PY - 2010/12

Y1 - 2010/12

UR - http://www.scopus.com/inward/record.url?scp=78049505312&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78049505312&partnerID=8YFLogxK

U2 - 10.1007/s11664-010-1389-8

DO - 10.1007/s11664-010-1389-8

M3 - Editorial

AN - SCOPUS:78049505312

VL - 39

SP - 2503

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 12

ER -