Four-band quantum well infrared photodetector array

S. V. Bandara, S. D. Gunapala, J. K. Liu, S. B. Rafol, D. Z. Ting, J. M. Mumolo, R. W. Chuang, T. Q. Trinh, J. H. Liu, K. K. Choi, M. Jhabvala, J. M. Fastenau, W. K. Liu

研究成果: Article同行評審

36 引文 斯高帕斯(Scopus)

摘要

A four-band quantum well infrared photodetector (QWIP) focal plane array (FPA) has been demonstrated by stacking different multi-quantum well structures, which are sensitive in 4-5.5, 8.5-10, 10-12, and 13-15.5 μm infrared bands. This 640 × 514 format FPA consists of four 640 × 128 pixel areas which are capable of acquiring images in these infrared bands. In this application, instead of quarter wevelength groove depth grating reflectors, three-quarter wavelength groove depth reflectors were used to couple radiation to each QWIP layer. This technique allows us to optimize the light coupling to each QWIP stack at corresponding pixels while keeping the pixel (or mesa) height at the same level, which will be essential for indium bump-bonding with the multiplexer. In addition to light coupling, these gratings serve as a contact to the active stack while shorting the unwanted stacks. Flexible QWIP design parameters, such as well width, barrier thickness, doping density, and the number of periods, were cleverly exploited to optimize the performance of each detector while accommodating requirements set by the deep groove light coupling gratings. For imaging, detector array is operated at temperature T=45 K, and each detector shows a very high D* > 1 × 1011 cm √Hz/W for 300 K background with f/2 optics. This initial array gave excellent images with 99.9% of the pixels working, demonstrating the high yield of GaAs technology.

原文English
頁(從 - 到)369-375
頁數7
期刊Infrared Physics and Technology
44
發行號5-6
DOIs
出版狀態Published - 2003

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學

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