Ga-based submicron particle and applications

Hseng Ming Liao, Che Yu Yeh, Shih Kang Lin

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

In our previous work, a novel transient liquid phase bonding (TLP bonding) process for Cu-To-Cu interconnection has been proposed. By using Ga as the bonding material as interconnect material for Ni/Cu substrates. A thermal stable solid solution bonding interface without intermetallic compounds can be formed. Compare to Ga (m.p. 29.7°C), Ga-In-Sn alloy, (m.p. 10.7°C) is another candidate for this novel Cu-To-Cu bonding material. Sonochemistry is applied to Ga-In-Sn alloy to synthesis particles. Ga-In-Sn particles around submicron level with oxide shell is characterized and the particle size is altered with organic solvent used in process, some of Sn phase are found to segregate into Sn nanoparticle.

原文English
主出版物標題2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
發行者Institute of Electrical and Electronics Engineers Inc.
頁面396-398
頁數3
ISBN(電子)9784990218850
DOIs
出版狀態Published - 2018 六月 6
事件2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 - Kuwana, Mie, Japan
持續時間: 2018 四月 172018 四月 21

出版系列

名字2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018

Other

Other2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
國家/地區Japan
城市Kuwana, Mie
期間18-04-1718-04-21

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 電子、光磁材料
  • 聚合物和塑料

指紋

深入研究「Ga-based submicron particle and applications」主題。共同形成了獨特的指紋。

引用此