摘要
Speed and power performances of Si-based stacked-nanowire gate-all-around (GAA) FETs and pragmatic ultra-thin-fin FETs at the 5nm CMOS technology node are projected, compared, and physically explained based on 3-D numerical simulations. The respective device domains are also used to compare integration densities based on 6T-SRAM layouts. Predicted comparable performances and densities, with considerations of the complexity/cost of GAAFET processing versus that of the FinFET with pragmatic simplifications, suggest that the FinFET is the better choice for the future.
原文 | English |
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文章編號 | 7890390 |
頁(從 - 到) | 164-169 |
頁數 | 6 |
期刊 | IEEE Journal of the Electron Devices Society |
卷 | 5 |
發行號 | 3 |
DOIs | |
出版狀態 | Published - 2017 5月 |
All Science Journal Classification (ASJC) codes
- 生物技術
- 電子、光磁材料
- 電氣與電子工程