摘要
Solder joints of silver-sheathed superconducting tapes are promising for various commercial applications. In this research, Pb, Ga, and Ga-doped lead-free Sn-Ag-Cu solders are used to study the gallium effect for the low joint resistivity with silver-sheathed DI-BISCCO type H tapes. In Ga-doped Sn-Ag-Cu solder, a smooth interfacial Ag2Ga layer is uniformly formed on the Ag-sheath surface. As a result, the solder joint achieved a very low joint resistivity of 16 nΩcm2 at 40 K. The present gallium-doped lead-free solder can also be applied to general soldering use with Ag materials.
原文 | English |
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文章編號 | 076303 |
期刊 | Materials Research Express |
卷 | 8 |
發行號 | 7 |
DOIs | |
出版狀態 | Published - 2021 7月 |
All Science Journal Classification (ASJC) codes
- 電子、光磁材料
- 生物材料
- 表面、塗料和薄膜
- 聚合物和塑料
- 金屬和合金