TY - GEN
T1 - GaN Schottky barrier photodetectors with multi-MgN/GaN buffer
AU - Lee, K. H.
AU - Chang, P. C.
AU - Chang, S. J.
AU - Wang, Y. C.
AU - Kuo, C. H.
AU - Wu, S. L.
PY - 2008/12/1
Y1 - 2008/12/1
N2 - GaN Schottky barrier photodetectors (PDs) separately prepared with a conventional single low-temperature (LT) GaN buffer layer and a multi-MgN/GaN buffer layer were both fabricated. It was found that we could reduce threading dislocation (TD) density and thus improve crystal quality of the GaN PDs by using the multi-MgN/GaN buffer layer. With a 2 V reverse bias, it was found that the reverse leakage currents measured from PDs with single LT GaN buffer layer and that with multi-MgN/GaN buffer layer were 4.57×10-6 and 1.44×10-12 A, respectively. It was also found that we could use the multi-MgN/GaN buffer layer to suppress photoconductive gain, enhance UV-to-visible rejection ratio, reduce noise level and enhance the detectivity.
AB - GaN Schottky barrier photodetectors (PDs) separately prepared with a conventional single low-temperature (LT) GaN buffer layer and a multi-MgN/GaN buffer layer were both fabricated. It was found that we could reduce threading dislocation (TD) density and thus improve crystal quality of the GaN PDs by using the multi-MgN/GaN buffer layer. With a 2 V reverse bias, it was found that the reverse leakage currents measured from PDs with single LT GaN buffer layer and that with multi-MgN/GaN buffer layer were 4.57×10-6 and 1.44×10-12 A, respectively. It was also found that we could use the multi-MgN/GaN buffer layer to suppress photoconductive gain, enhance UV-to-visible rejection ratio, reduce noise level and enhance the detectivity.
UR - http://www.scopus.com/inward/record.url?scp=63249105825&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=63249105825&partnerID=8YFLogxK
U2 - 10.1109/EDSSC.2008.4760683
DO - 10.1109/EDSSC.2008.4760683
M3 - Conference contribution
AN - SCOPUS:63249105825
SN - 9781424425402
T3 - 2008 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC
BT - 2008 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC
T2 - 2008 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC
Y2 - 8 December 2008 through 10 December 2008
ER -